JPH0260243U - - Google Patents
Info
- Publication number
- JPH0260243U JPH0260243U JP13953088U JP13953088U JPH0260243U JP H0260243 U JPH0260243 U JP H0260243U JP 13953088 U JP13953088 U JP 13953088U JP 13953088 U JP13953088 U JP 13953088U JP H0260243 U JPH0260243 U JP H0260243U
- Authority
- JP
- Japan
- Prior art keywords
- reference hole
- metal plate
- package
- center
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims 3
- 230000002093 peripheral effect Effects 0.000 claims 1
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13953088U JPH069510Y2 (ja) | 1988-10-26 | 1988-10-26 | 基準孔付半導体素子用パッケージ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13953088U JPH069510Y2 (ja) | 1988-10-26 | 1988-10-26 | 基準孔付半導体素子用パッケージ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0260243U true JPH0260243U (en]) | 1990-05-02 |
| JPH069510Y2 JPH069510Y2 (ja) | 1994-03-09 |
Family
ID=31402875
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13953088U Expired - Lifetime JPH069510Y2 (ja) | 1988-10-26 | 1988-10-26 | 基準孔付半導体素子用パッケージ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH069510Y2 (en]) |
-
1988
- 1988-10-26 JP JP13953088U patent/JPH069510Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH069510Y2 (ja) | 1994-03-09 |